Tech Roadmap
| Item | Current | 2026 | 2027 | |
| Max. Layer | 120 | 140 | 200 | |
| Track width/space | inner（mil） | 1 / 1.5 | 0.98 / 0.98 | 0.8/ 0.8 |
| outer（mil） | 1 / 1.5 | 0.98 / 0.98 | 0.8 / 0.8 | |
| Aspect Ratio | 15 : 1 | 14 : 1 | 15 : 1 | |
| Copper Weight (oz) | 12 | 15 | 20 | |
| Impedance tolerance | ±5% | ±4% | ±4% | |
| Material | Microwave material | SV | SV | SV |
| Via in pad | SV | SV | SV | |
| Lead-free | MP | MP | MP | |
| Mix lamination | / | P | SV | |
| Metal Based/Core | P | SV | SV | |
| HiTg | MP | MP | MP | |
| HDI | 1+N+1 | HDI:8+N+8 | HDI:10+N+10 | HDI:10+N+10 |
| Buried resistance/electric capacity | MP | MP | MP | |
| P: Prototype SV: Small Volume MP: Mass Production | HDI:8+N+8 | HDI:10+N+10 | HDI:12+N+12 | |