|
ltem
|
2025
|
2026
|
2027
|
|
Max PCB layers
|
120
|
140
|
160
|
|
Max Board Size
|
59in&22in
|
59in&24n
|
59in* 26in
|
|
Max. Board Thickness
|
314mil
|
394mil
|
472mil
|
|
Min. Board Thickness
|
8mil
|
6mil
|
4mil
|
|
Min. Core Thickness
|
2mil
|
1mil
|
0.5mil
|
|
Max.FinalCopper
Thickness
|
Inner Layer
|
12 0Z
|
14 0Z
|
20 0Z
|
|
Outer Layer
|
12 0Z
|
14 0Z
|
16 0Z
|
|
Min. Line
Width/Space
|
2mil/2mil
|
1.5mil/1.5mil
|
0.5mil/0.5mil
|
|
Impedance Control
|
±10%/±5%
|
±10%/±5%
|
±5%/±2%
|
|
Min. CNC Drilling
Size
|
4mil
|
4mil
|
2mil
|
|
Min, Laser Drilling
Size
|
3mil
|
3mil
|
2mil
|
|
Min.
PAD Size
|
Inner Layer
|
6mil
|
5mil
|
4.5mil
|
|
Outer Layer
|
5mil
|
4mil
|
3mil
|
|
Min.Distance
between Via edges
|
10mil
|
8mil
|
7mil
|
|
Aspect Ratio
|
0.75
|
0.75
|
0.83
|
|
HDI Production
Capability
|
8+N+8
|
10+N+10
|
12+N+12
|
|
SMT MIN PITCH
|
10MIL
|
8MIAL
|
7MIL
|
|
Flex board Max
layers
|
12Layer
|
20Layer
|
35Layer
|
